Winbond

Winbond is heading to FMS 2026 in Santa Clara! We're excited to participate in FMS 2026, where innovators across the memory and storage ecosystem come together to explore the technologies shaping the future of AI and data-driven applications. Visit Winbond at Booth #719 to discover our latest memory innovations, including: 🔹 CUBE (Customized Ultra-Bandwidth Elements) – A high-bandwidth, power-efficient memory architecture designed to meet the growing demands of Edge AI. 🔹 TrustME® Secure Flash – Hardware-based security solutions that enhance firmware resilience and support post-quantum-ready protection for connected systems. 🔹 Code Storage Flash Memory – Reliable NOR and NAND Flash solutions optimized for embedded, industrial, automotive, and AI applications. Whether you're exploring next-generation memory architectures, embedded security, or Edge AI system design, our team will be on-site to discuss how Winbond's solutions can help accelerate innovation. 📍 FMS 2026 | Santa Clara, CA 📍 Aug 4-6, 2026 📍 Booth #719 We look forward to connecting with customers, partners, and industry professionals at the show. See you in Santa Clara! #Winbond #FMS2026 #Memory #Semiconductors #EdgeAI #CUBE #TrustME #SecureFlash #NORFlash #NANDFlash #EmbeddedSystems #AI #Automotive #Industrial

🚀 Winbond Showcases Intelligent Memory Solutions at electronica China 2026 From July 1–3, Winbond proudly participated in #electronicaChina at the Shanghai New International Expo Centre, showcasing our comprehensive portfolio of memory and security solutions designed for next-generation #automotive, #industrial, and #intelligentedge applications. We highlighted three core product lines: 🔹 Customized Memory Solution : Featuring our CUBE series and the newly introduced CUBE-Lite, meticulously engineered with 3D stacking to deliver high bandwidth and ultra-low power for Edge AI and TinyML devices. We also highlighted our high-bandwidth DDR4 and LPDDR4/4X solutions paired with leading SoC platforms for advanced automotive cockpits and real-world edge hardware. 🔹 Code Storage Flash Memory: Including high-speed Octal NAND, QSPI NOR Flash, and ultra-low-power HYPERRAM™. Key demonstrations a 256Mb QSPI NOR Flash paired with Oritek LQ560V200 SoC optimized for high-bandwidth, low-latency ADAS real-time data processing. 🔹 TrustME® Secure Flash : Featuring our certified W77Q Secure Flash series acting as the hardware Root of Trust (RoT). Deployed across IPCs, Linux AIoT devices, and IIoT secure routers, the W77Q series delivers essential functional safety and cyber-resilience through its robust protect-detect-recover mechanisms to shield critical connected infrastructure. We appreciate the opportunity to connect with global Tier 1 suppliers, OEMs, SoC innovators, and ecosystem partners at Booth 209 (Hall N5) as we continue turning intelligent memory innovation into real-world impact through open collaboration.

In edge AI deployment, the primary bottleneck is no longer the processor—it’s the memory interface. Traditional scaling pushes devices past their thermal, power, and board-space limits. Winbond is solving this with a powerful three-pronged architecture designed to eliminate edge constraints: ⚡ CUBE: Delivers up to 256GB/s per die, scaling to 1TB/s in a 4Hi stack via advanced 3D TSV/die-to-die interconnects. 🔋 CUBE-Lite: Optimized for TinyML and battery-powered, always-on endpoints (like smart glasses and wearables) where power and integration matter most. 🔒 TrustME® W77Q Secure Flash: Safeguards AI models and firmware with Secure Boot and Root-of-Trust.　 We are enabling and ready for a comprehensive ecosystem for next-gen local AI processing. 👉 Read the full article: https://reurl.cc/53Y3V

🚀Elevating Performance: Winbond's W35T-NW Octal NOR Flash Empowers Next-Gen Edge AI and Automotive Innovations. In the era of Generative AI and advanced automotive systems, instant-on capability and high-bandwidth memory are no longer optional—they are critical to market success. As the world's leading supplier of NOR Flash memory, Winbond is proud to showcase the W35T-NW series, our high-bandwidth 1.8V Octal NOR Flash tailored for mission-critical applications. Key Technical Highlights: ✨High Bandwidth: Equipped with 8 I/Os and supporting up to a 200MHz high-speed clock for rapid system boot-up. ✨Scalable Density: Available in capacities ranging from 64Mb to 2Gb, offering maximum design flexibility. ✨Industrial-Grade Reliability: Engineered for high endurance, long-term stability, and secure supply longevity. From automotive electronics and robotics to smart IoT and Edge AI devices, the W35T-NW series delivers the optimal balance of speed, reliability, and power efficiency. 👇 Watch the video below to discover how Winbond is driving the future of high-performance storage solutions. https://lnkd.in/gBbCGSMw #Winbond #Semiconductor #NORFlash #OctalFlash #AutomotiveElectronics #EdgeA #W35T #HighBandwidth #Reliability #Flash #Memory #Security #CMS #DRAM #SmartHome #RoboticArms #Automotive

【 TrendForce Compuforum Recap: Overcoming AI Server Memory Bottlenecks 】 As tech giants deploy proprietary solutions , AI server racks now require over 400+ code storage flash devices to sustain high-density performance. At the TrendForce Compuforum, Winbond highlighted why robust memory architectures are vital not just for xPUs, but for BMCs, SmartNICs, and cooling subsystems. Winbond is bridging these hardware infrastructure gaps across 4 core vectors: 🛠️ Robustness: W25Q-RV/RW supports 105°C ambient temps. Its On-chip HW ECC corrects code with zero-latency execution, eliminating bit-flips. 🛡️ Security: W77Q/T complies with NIST SP 800-193 platform firmware resiliency. It supports Post-Quantum Cryptography (LMS) to block unauthorized execution. ⚡ Performance: Clock rates up to 200MHz enable high-throughput Execution-in-Place (XIP), maximizing host SRAM bandwidth and powering rapid OTA updates. 🌱 Low-Voltage: W25Q-NE (1.2V) and W25Q-PY (1.2V I/O) eliminate extra LDOs. This lowers BOM costs and resolves high-frequency signal integrity (SI) challenges. Winbond’s comprehensive portfolio is built to fuel the next wave of generative AI computing. Explore our complete product portfolio: https://lnkd.in/gupJaVNd #Winbond #Compuforum #AIServer #HardwareSecurity #FlashMemory #EdgeAI #NORFlash #OTA #W25QRV #Security #Memory #LowVoltage #Industrial

When firmware is compromised, an entire organization's infrastructure can collapse in seconds. In today's threat landscape, basic security isn't enough. True cyber resilience is non-negotiable. How is your organization preparing for next-generation threats, including the upcoming quantum era? Discover how Winbond’s W77Q-NW series redefines platform firmware resilience. Fully compliant with NIST SP 800-193 standards, this post-quantum-ready secure Flash Memory delivers robust protection directly embedded in standard NOR Flash: 🛡️ Cryptographic Write-Protection – Preventing unauthorized modifications at the hardware level. 🔍 Continuous Integrity Validation – Constantly monitoring firmware to detect anomalies instantly. 🔄 Safe Firmware Fallback & Watchdog Recovery – Ensuring rapid self-healing and zero-downtime recovery if a breach occurs. ⚛️ LMS Post-Quantum Cryptography (PQC) – Future-proofing your devices against tomorrow's quantum computing threats. Watch this short video to see how you can build a resilient, forward-looking defense today. 👇 🎬 https://lnkd.in/gXjc25mY #Winbond #Memory #Security #PQC #LMS #W77QNW #NIST #Resilience #Flash

In today’s data-driven landscape, advancing application performance shouldn’t come at the cost of our planet. At Winbond, we believe true innovation must be sustainable. We are excited to share our latest on-demand webinar, where we dive deep into how Winbond integrates sustainability into both our advanced manufacturing processes and product design—helping you meet both your performance demands and corporate carbon-reduction targets. 💡 What you’ll learn from this session: 🔹Green Manufacturing: How Winbond advances sustainability through renewable energy and carbon-reduction initiatives. 🔹Octal NAND Flash: Empowering automotive and industrial applications with ultra-fast boot and seamless OTA (Over-the-Air) updates. 🔹1.2V NOR Flash: Redefining low-power system design for next-generation energy-efficient applications. Whether you are designing for automotive, industrial, or high-performance edge systems, this webinar will provide actionable insights into building a greener, faster future. ⏰ Watch the webinar on-demand now and stay ahead of the curve! 👉 https://lnkd.in/eWHPhGUZ #Winbond #Semiconductor #FlashMemory #Sustainability #ESG #Automotive #IndustrialIoT #Webinar #NORFlash #OctalNAND #Memory #GreenProduct #LowPower

【Overcoming Power & Space Constraints in Edge AI Wearables】 The integration of Edge AI into next-generation smart glasses—as highlighted at CES 2026—is unlocking powerful features like real-time translation and AR navigation. However, packing these capabilities into slim, stylish frames forces engineers to manage extreme space, power, and thermal constraints. To deliver a lag-free user experience within a tiny hardware footprint, the memory subsystem has become the ultimate design bottleneck. Here is how Winbond memory architectures are breaking these barriers: ✔️ QSPI NOR Flash: Operating at 1.8V (and down to 1.2V), solutions like Winbond’s W25Q32JWBYIQ directly share power rails with the processor core. This simplifies power distribution, boosts read speeds by 30%, and reduces read power by up to 66%—directly easing consumer "battery anxiety." ✔️HYPERRAM™ Performance: Replacing conventional DRAM/pSRAM, HYPERRAM™ uses the HyperBus interface to operate on just 13 signals. This slashes pin counts, lowers PCB complexity, and delivers up to 400MB/s throughput while consuming a mere 35µW in hybrid sleep mode—making it ideal for real-time sensor fusion and display buffering. Designing next-gen wearables is an exercise in extreme constraint management. The synergy between ultra-low voltage QSPI NOR Flash and HYPERRAM™ eliminates electrical and physical barriers, making AI glasses and wearable devices a reality. For more information, please check our latest article: https://reurl.cc/K25zme #EdgeAI #SmartGlasses #Wearable #Semiconductor #MemorySolutions #QSPINORFlash #HYPERRAM #Winbond #CES2026 #CMS

🌟 Revolutionizing Edge AI: Highlights from Embedded Vision We are thrilled to wrap up a successful showcase at Embedded Vision! A sincere thank you to all the partners, engineers, and visionaries who stopped by the Winbond booth to see our latest innovations in action. For those who couldn't make it, here’s a quick recap of how our CUBE and CUBE-Lite technologies are redefining the memory roadmap for Edge AI: CUBE: For Maximum Performance 🔹Designed for demanding AI workloads. 🔹Leverages 3D architecture to solve thermal challenges. 🔹Delivers bandwidth up to 256GB/s per die at less than 1pJ/bit. CUBE-Lite: For Scalable, Low-Power Deployment 🔹Purpose-built for battery-powered TinyML endpoints like drones, wearables, and AI cameras. 🔹Consumes just 20% of the power of LPDDR4X. 🔹Simplifies system integration by eliminating the need for an LPDDR4 PHY. Together, CUBE and CUBE-Lite provide a comprehensive memory roadmap for SoC producers and system builders worldwide, unlocking the true potential of real-time, always-on AI. #Winbond #EdgeAI #CUBE #CUBELite #EmbeddedVision #TinyML #Innovation #Semiconductor #TechTrends #AIoT #ThankYou #Memory #AI

Dr. Pei Lin Pai, CTO of Advanced Technology Development Group at #Winbond, will be presenting on how Computation-in-Memory eliminates the energy-intensive data movement between processor and memory, performing parallel operations directly within the memory array to power the next generation of energy-constrained, intelligent edge devices. 📅 12–13 May | 📍 Taipei, Taiwan 🔗 Register your interest → https://lnkd.in/dE2gRmai