TA Instruments

We recently ran a heat-to-failure study on a lithium-ion coin cell, tracking heat flow, off-gas composition, and open-circuit voltage simultaneously, without ever disassembling the cell. Testing the battery intact, rather than tearing it down into individual components, turned out to matter more than expected: some of the most telling signals only show up when cathode, anode, and electrolyte are interacting exactly as they do in a real, working cell. A few things stood out: • Electrical drift showed up before any obvious sign of thermal failure, raising the question of which one is actually driving the other • The point where the cell vented lined up precisely with a specific chemical signature in the off-gas • The most energetic reactions in the entire test happened in a surprisingly narrow temperature window, and didn't unfold in the order expected relative to the internal short circuit None of these observations would have been possible from a single measurement type in isolation. It's the correlation across signals, at the same moments in time, that starts to reveal the actual mechanism and the actual order of events behind battery failure. Explore the full study, data, and discussion here: https://lnkd.in/eAv4rMcc

Dispensing and flow are important for a variety of electronics manufacturing techniques and materials. From the precise application of solder pastes and adhesives to new developments in flexible electronics and additive manufacturing methods, rheology plays a key role in improving processability, product quality, and manufacturing consistency. Rheology is the study of deformation and flow when a force is applied, making it crucial for optimizing electronics manufacturing. Rheology answers critical questions across various electronics applications such as: • How does my solder paste change during storage, and how can I predict its shelf life? • What is the ideal viscosity of my inkjet-printed electronic circuits? • Will my thin film or epoxy hold its shape or slump before drying/curing? • Will my material flow easily or clog in my syringe? Read the full blog: https://lnkd.in/e36ivPQK

Interfaces shape everything from emulsions to foams to biopharma formulations, but measuring them quantitatively has always been the hard part. In this on-demand seminar, we break down interfacial rheology and Double Wall Ring (DWR) geometry, used for measuring viscoelastic properties at liquid-liquid, liquid-gas, and liquid-air interfaces. Whether you work in food, biomedical, or formulation science, this is a deep dive into how surface and interfacial behavior drives the properties of your materials. Watch the on-demand seminar now: https://lnkd.in/eEz98hiT

Every DSC measurement starts with one simple question: how much more (or less) power does your sample need than a reference to keep pace with a temperature ramp? This new explainer video, featuring Simon Gaisford, covers: - Onset vs. peak temperature, and when the distinction gets tricky - Why your reference keeps climbing while your sample holds steady mid-melt - What baseline position reveals about heat capacity - Practical details like pan materials, lids, and sample mass that shape your results Get a clear, visual refresher on the fundamentals behind your DSC data. Watch the full video below:

Battery casing materials, like aluminum, polymers, and Ni-coated steels, each bring different strengths to the table for chemical resistance, corrosion protection, and durability. See how TGA, DSC, mechanical testing, and DMA help characterize these materials from moldability through real-world impact resistance. Explore the full picture - https://lnkd.in/e9uK2urS

Many new therapeutic treatments have poor solubility and are difficult to incorporate into conventional drug delivery methods without losing bioavailability. Lyophilization is used to create amorphous solid dispersions that can be delivered in their solid state. This technical brief discusses the use of temperature modulated differential scanning calorimetry (Modulated DSC™ Technology) to study the thermal properties of frozen solutions which are candidates for lyophilization (freeze-drying). Changes in the freezing conditions and annealing of the frozen solution can change the thermal response resulting in a more efficient lyophilization step. Read the Tech Brief → https://lnkd.in/eYhPqGyA

Every implant and prosthetic has a lifetime. Proving it requires putting devices through the same physiological forces they'll face in the human body. There are two ways to test for it: - Testing to success — confirms a device survives physiological loading for its intended lifetime - Fatigue to fracture — pushes devices past their limits to find exactly where and how they fail Both give engineering teams the evidence to catch problems at the design stage, not after. Curious which method fits your application? Read the full blog: https://lnkd.in/ezpBXvwY

In this TA Tech Tip we demonstrate the sample preparation procedures for the Coin Cell Differential Scanning Calorimeter, including the preparation of an indium sample for calibration.

When a customer’s chosen epoxy failed at a lower stress load than expected, Inkbit set out to create a more durable, functional material to suit their industrial application. See how the TA Instruments Electroforce Apex 1 helped them engineer a higher-performing digital material in just six months. Inside the case study explore how Inkbit: • Diagnosed a real-world part failure with tensile and DMA temperature testing  • Screened seven material formulations without lab-scale reformulation  • Verified strength, stiffness, and fatigue life at true end-use temperatures  • Moved from failure analysis to a qualified, production-ready material Download the case study → https://lnkd.in/gHcfhNJ5

As PCBs get smaller and more complex, the margin for thermal-related failure narrows. Testing individual components in isolation has limits. Coatings, adhesives, and laminates interact under real operating conditions, and those interactions are where hidden defects tend to live. Thermal analysis methods give PCB researchers a more complete picture: dimensional behavior through the glass transition (TMA), material stability under heat (TGA), curing completeness in protective coatings (DSC), mechanical response during soldering (DMA), and heat transport characterization for thermal management design (flash diffusivity). Each technique addresses a different stage of the development cycle. Together they build a foundation for reliability that component-level testing alone cannot provide. Read the Full Blog: https://lnkd.in/eq5kq9vN