T-Global Technology

Our latest newsletter has just landed! If you're working in thermal management or electronic design, this edition is packed with practical insights to help you stay ahead. Inside you'll find: - An introduction to our new ASTM E595-certified TG-AD30D thermal pad - Key industry applications for display panels - An important NRND update for one of our thermal tapes - A simple thermal pad selection guide to help you choose the right solution for your next project Read the latest issue online or subscribe to receive future editions direct to your inbox via the links in comments.

As Europe experiences another record-breaking heatwave, it's a reminder that heat isn't just a challenge for people, it's one of the biggest issues facing modern electronics. From AI servers and EV power electronics to industrial automation and telecommunications, higher operating temperatures can reduce performance, shorten component lifespan and impact long-term reliability. With ambient temperatures rising, effective thermal management becomes even more critical. Recent heat records across the UK and Europe have highlighted how extreme temperatures are increasingly affecting infrastructure and technology alike. That's where thermal interface materials (TIMs) play a vital role. By efficiently transferring heat away from critical components, high-performance TIMs and next-gen thermal management solutions help engineers maintain system reliability, improve efficiency and support longer product lifecycles, even in demanding environments. At T-Global Technology, we work with customers across a range of industries to solve complex thermal challenges through a comprehensive range of thermal management solutions, including thermal pads and putties, phase change materials, vapor chambers, heat spreaders and more. Find out more about our full product range and services via the link in the comments.

We’re here at Hardware Pioneers Max showcasing our range of thermal management solutions, come and see us at stand C10 and pick up your free sample pack. #thermalmanagement

Introducing TG-AD30D Low Outgassing Thermal Pad: T-Global Technology is pleased to announce the launch of the new TG-AD30D, an advanced low-outgassing thermal pad designed for applications where thermal performance, reliability, and material stability are critical. Engineered to ASTM E595 standards for demanding applications across aerospace, AI infrastructure, datacom, automotive electronics, energy storage, military systems, and advanced industrial equipment, TG-AD30D helps manufacturers address thermal challenges without compromising long-term system reliability. With a thermal conductivity of 3.0 W/mK, low thermal impedance and excellent electrical insulation properties, TG-AD30D is optimised for high-power applications requiring efficient heat transfer and dependable mechanical compliance with minimal outgassing. TG-AD30D extends our hybrid thermal pad portfolio with a material specifically developed for applications where outgassing performance is a major design consideration, this product enables customers to achieve reliable thermal management in increasingly sensitive and high-performance electronic systems. Find out more via the link in comments.

Our latest newsletter has just landed! Highlights include details on our latest product launch for our best in class reinforced thermal pad TG-A9000F, details on how to access our thermal simulation service, the last chance to secure your free tickets to Hardware Pioneers Max, and a showreel for our TG-AD hybrid thermal pad series. To view the latest issue or sign up for future editions check out the links in the comments.

We’re pleased to announce the launch of TG-A9000F Reinforced Thermal Pad, our best in class reinforced thermal pad designed for demanding, high-power applications. With 7.0 W/mK thermal conductivity, a single-sided fibreglass reinforced design, low thermal impedance and strong tear resistance, TG-A9000F Reinforced Thermal Pad offers a reliable option for applications such as servers, data centres, and PSUs. Its combination of compressibility, electrical isolation, and dimensional stability helps support easier processing and dependable long-term thermal performance in challenging environments. Find out more in the link in comments.

We're looking forward to exhibiting at Hardware Pioneers Max next month. Find us at Stand C10 on 10-11 June...

Our latest newsletter has just landed! Highlights include details on an exciting new partnership with a leading European fabless designer, how to secure yourself a free ticket to the UK's largest show for electronics, our supply chain resilience and a showreel for our high elasticity thermal gel series. To view the latest issue or sign up for future editions check out the links in the comments.

T-Global Technology Europe and North America will be exhibiting at Hardware Pioneers Max 2026: 10-11 June, ExCel London. We're delighted to announce that T-Global Technology will be exhibiting at Hardware Pioneers Max 2026, the UK’s largest exhibition and conference for cutting-edge electronics, engineering innovation, and hardware development. T-Global Technology will be located at Stand C10 where visitors can speak directly with our team about their heat dissipation challenges, product design requirements, and performance optimisation needs. The team will provide guidance on selecting the most suitable thermal interface materials for a wide range of applications, including consumer electronics, automotive systems, industrial equipment, and telecommunications. To find out more, including a chance to bag yourself a free ticket to show on us check out the link in comments...

#EarthDay2026